adhesive dispensed on chip

Adhesive Technologies

作者:n.n

摘要:在两个键合物之间,有多种施加胶粘材料的方法:点胶、丝网印刷、蘸胶或作为中间连接用途的薄膜。本篇技术论文提供了不同胶粘材料和相关胶粘技术的概览,并且介绍了典型的性能和应用领域。


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