VCSEL array bonding

VCSEL封装

作者:Martin Rogge

摘要:光电器件的封装是微组装的关键应用之一。高密度封装的多路发射器、接收器及收发器是近来瞄准高带宽需求的光子学发展的重要基础。相应地,贴装这些元器件要求高贴片精度,并且使用多种封装技术。本文描述了其中的一些挑战以及Finetech针对VCSEL和探测器封装提供的解决方案。

 

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Finetech USA/East Coast
+1 603 627 8989
Send an email

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