Flip Chip Rework

倒装芯片返修

作者: Dan Lilie

摘要: 倒装芯片现如今还很少应用于PCB组装领域,但随着电子产品小型化趋势的要求,将变得越来越重要。倒装芯片是一种裸芯片,是以正面朝下的形式贴装到基板之上,无需引线键合。其尺寸非常小。它也几乎是拥有数千个导电连接点的复杂电路的唯一封装形式。一般情况下,倒装芯片是通过加热加压(热压焊接)来组装的,当然也包括其它工艺,如回流焊接、超声焊接或扩散粘接等。本技术论文则侧重于PCB板上的倒装芯片的返修。

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Finetech USA/East Coast
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