Single ball repair on BGA

单球返修

作者: Dan Lilie

摘要: 往往一个球的缺陷,会导致整个阵列器件无法使用。如果拥有了单球返修的能力,也就意味着整个器件能够得以修复。传统的SMD返修工艺,首先需要把一个缺陷球体移除。然后用一个新的焊球替换。其中最大的挑战是在整个加热回流过程中不能对其它周边焊球造成影响。这就需要一个特殊的解决方案。如果越是继续朝着器件小型化的方向发展,对解决方案的要求将变得更加细致。只有配备合适的工具头,压力控制系统以及高分辨率的光学对位系统的返修设备才能满足如此苛刻的要求。

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

Download now
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.