堆叠封装(PoP)返修

作者: Dan Lilie

摘要: 堆叠封装(PoP)是通过堆叠的方式实现电路互连的封装形式。下层的模块是逻辑元器件,通常被称之为底部封装,上层的模块是存储器模块,通常被称之为顶部封装。这样,两个或两个以上的封装体可以进行堆叠或垂直组合。由于封装密度的增加,堆叠封装方案特别常见于通讯技术领域(例如移动产品)。这种三维封装的返修不仅需要顶部和底部加热(热管理)的组合,同时需要特殊的吸头设计以便在一个工艺循环中拾取元器件。

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