repair of underfilled SMD

填充胶返修

作者: Dan Lilie

摘要: 底部填充胶在消费电子 (移动产品, 手提电脑等),汽车工业 (传感器模块,引擎控制单元等) 以及采用倒装芯片的小型化产品领域的使用极其普遍。对元件进行底部填充能够极大的提升产品的整体质量,可靠性和寿命。底部填充胶可有效避免潮湿,热应力以及各种机械外力的影响。但同时底部填充胶也对返修工艺提出了极大的挑战。因为除了热量,还需要机械力来实现将芯片与基板分离。至今为止,还没有真正意义上的 “可返修底部填充胶”,而返修的成败主要取决于使用的材料,表面特性,以及元器件与基板的质量。当然,设备和相应的配套工具也会对返修的成功与否起到决定性的作用。在一些特定情况下,比如元件和基板十分昂贵,难以获取,或者为了挽救整批成品,底部填充胶返修不失为一个值得一试的解决方案。

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Finetech USA/East Coast
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