Solder paste printing on board

施加锡膏

作者: Dan Lilie

摘要: 返修SMD元器件往往需要在PCB焊盘上施加新的锡膏。工业标准是丝网和钢网印刷,但是由于密集的PCB板空间有限,这种方案并不适用于所有情况。可行的解决方案往往需要根据当前的条件单独定制。Finetech可以在整个返修过程中提供多种不同的锡膏施加解决方案。

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Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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  • access to technical data sheets (after activation)
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