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柔性基板上的元器件返修

作者: Dan Lilie

摘要: 柔性基板通常应用于三维互联和机电一体化概念领域,以降低连接器的需求数量。它可以经受高强度的弯曲,并可以在不同的电路层之间实现高速互连。在便携式产品的应用中,最大限度的微型化可以通过折叠PCB来实现。典型的应用有医疗设备(助听器、胰岛素泵、神经刺激器植入)、消费电子产品(移动电话、便携式计算机、相机、TFT显示器)以及汽车系统(传感器模块、发动机控制单元)。柔性基板的元器件返修本质上是材料处理问题。温度曲线说明柔性基板相比于PCB具有更低的热容量 - 更短的加热时间和更低的达到液相的温度。柔性电路的返修需要可替换的真空固定装置和热传导的加热模式、而非传统的低温对流加热。

 

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