Residual solder removal on PCB

残留焊锡清除

作者: Dan Lilie

摘要: 精确移除残留焊锡是大多数返修成功与否的关键因素,这个步骤业界通常是借助烙铁和吸锡带完成的。然而,移除残留焊锡的质量完全取决于操作人员的操作技巧。通常还容易发生焊盘脱落或阻焊层被破坏的情况。长远来看元器件的尺寸很明显将会不断地缩小、封装密度也会越来越高,这意味着使用合适的方法来移除残留焊锡将是一种越来越大的挑战,这就使得Finetech非接触式移除残留焊锡解决方案有了用武之地。从小型无源电阻到大型BGA,我们的解决方案几乎适用于市场上所有的SMD元器件。

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Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

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