BGA grid - reballing

阵列植球

作者: Dan Lilie

摘要: 精确放置新的锡球阵列被称之为阵列植球,这种返修工艺可以节省宝贵的资源(和成本)或拓展价值链。当BGA贴错位置时,施加锡膏的压力不够时,或电路板的焊盘被氧化以及锡球不再有接触时,这些情况通常需要阵列植球。这些通常都是导致锡球需要被替换的典型缺陷。但在植新的锡球之前,必须先移除整个锡球阵列中的残留锡膏,然后再元器件上植新的锡球。充分且平坦地移除残留锡膏、重熔和润湿新的锡球都是工艺的关键。尤其对于那些通常不适合植球的元器件来说,根据客户需求和产品定制可靠的工艺才能得到高质量的返修结果。

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Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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