BGA GPU CPU rework

BGA/CSP和CPU/GPU元件返修

作者: Dan Lilie

摘要: 像BGA这样的大球阵列元件,中央处理器(CPU)和图像处理芯片(GPU),以及CSP这样的微间距小球芯片的返修,都对返修工艺提出了无空洞的焊接效果以及精确的对位要求。与此同时,也对返修设备提出了特殊的要求,比如需要精确的热量管理能力,精准的贴片精度,以及高分辨率的光学对位系统来保证。
如今,BGA返修几乎成了SMD返修的代名词。但是,文中展示的Finetech返修解决方案等信息不止局限于阵列封装器件,而是适用于整个SMD返修领域。

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
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Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

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