QFN rework - process camera view

QFN-MLF元件返修

作者: Dan Lilie

摘要: 扁平封装器件如QFNs (四方扁平无引脚) 和MLFs (微引线框架) 器件,具有突出的热敏感和热容性等特性 (例如极短的响应时间) ,正越来越多的应用到高密度,空间利用率高的产品之中。与BGA元件不同,QFN元件并没有自带的焊料用于表面贴装,但必须将焊盘直接贴装到引线框架的金属底盘上。这使得与处理常规的SMD元件相比提出了更大的要求。通常, QFN和MLF元件上焊盘较多不易除锡。不仅是热量容易快速的消散在板子上,而且焊料液化后的粘力也增加了除锡的难度。只有采用合适的喷嘴和专业的方法方能实现。施加新焊料时必须加以小心,否则过多的焊锡会导致元件无法回流到正确的位置。

Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

Download now
Your Sales Contact James Bishop

Finetech USA/East Coast
+1 603 627 8989
Send an email

Full access with a free user account

With an user account you get:

  • instant access to all product flyers
  • access to technical data sheets (after activation)
  • access to technical papers and white papers (after activation)

Non-Business Email Address Detected
We strongly recommend to use a business email address for the registration. Our IT security policy restricts the use of public email addresses. You may not receive a response.