3D Packaging

FINEPLACER® sigma系统的评估,关于多种互连方式的应用综述

作者:
Sascha Lohse (Finetech GmbH & Co. KG)
Alexander Wollanke (Fraunhofer IZM-ASSID)

 

摘要: 由于电子产品日趋小型化,轻量化和多功能化,对集成电路封装的要求也变得越来越高。更复杂的电路,更微小的间距,微凸点设计,芯片堆叠技术正是业界关于如果满足这些要求的典型案例。如何寻求到一个合适的3D封装工艺是一项巨大的挑战。本文主要阐述了3D封装领域中广泛运用的多种互连方案。使用FINEPLACER® sigma系统完成各种多凸点数量(最多143000个),微间距(最小25微米),小球径 (最小13微米) 芯片的贴片实验。此文还描述了不同3D集成技术的测试过程,并给出了所使用的工艺参数和测试结果。

 

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Finetech USA/East Coast
+1 603 627 8989
Send an email

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