FINEPLACER® pico 2 - Multi-Purpose Manual Die Bonder for R&D and Lab
The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities.
FINEPLACER® femtoblu - Chip-on-Submount (CoS) Assembly
The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications. This video shows the assembly of edge-emitting laser diodes to AlN submounts.
New FINEPLACER® lambda 2 product introduction
The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
FINEPLACER® femto 2 – 基板传送和点胶模块
FINEPLACER® femto 2 – 3D操纵杆
3D操纵杆可以让您快速简单地操作设备 – 当您结合视觉系统和测量功能时它将更加实用。您可以通过该操纵杆随意从全自动模式切换到手动模式。无需编程即可得到无与伦比的贴片结果。
Au-Au Thermosonic Flip Chip Bonding
Au on Au bonding process combines low temperature heat and moderate force aided by ultrasonic motion in the 60 - 100 kHz range - suitable for low to medium I/O count devices. Finetech systems provide optimized field of view for alignment and visual inspection in-situ.